产品服务 —— 图像分析

Imaging and Analysis   图像分析


·   ·   Field Emission Scanning Electron Microscope (FE-SEM)

  场发射扫描电子显微镜
Imaging from 10 V to 30 kV
Resolution: 0.8 nm at 15 kV; 1.2 nm at 1 kV.
Magnification: 25 times to 1,000,000 times.
The FESEM has 4 detectors:

¯  In lens secondary detector and Everhart Thornley secondary detector

¯  Energy selective secondary/backscattered electron detector for topography/compositional contrast imaging at low voltages.

¯  Retractable backscatter detector for composition contrast imaging

Aperture Control lens that automatically optimizes the probe current and beam size depending on the imaging conditions.
Beam deceleration mode to reduce charging of non-conducting specimens.
Motorized stage with travel in 5 axes.
Integrated 200 mm airlock for fast sample changes.

·   Scanning Transmission Electron Microscope (STEM)
扫描透射电子显微镜
Acceleration voltage range: 80 kV to 300 kV with preset alignment for 80 kV, 200 kV, and 300 kV.
Scanning transmission electron microscopy mode.
Convergent beam and selected area electron diffraction modes.
Conventional TEM modes.
Point-to-point spatial resolution in TEM mode: 0.20 nm at 300 kV.
STEM resolution: 0.136 nm at 300 kV.
Super-twin objective lens pole piece.
Gatan Orius digital camera (2000 x 2000 pixels).
Fischione high angle annular dark field STEM detector for Z-contrast imaging.
Gatan QuantumSE™ energy filter for electron energy loss spectroscopy and energy-filtered TEM; filter energy spread: 0.8 eV.
EDAX Si(Li) x-ray energy-dispersive spectrometer; energy resolution: 0.136 eV.
Tomography acquisition, reconstruction, and analysis software.
Analytical, heating, cooling, and tomography specimen holders.

·     High Resolution Atomic Force Microscope
高分辨率原子力显微镜
Phase imaging, contact mode, and tapping mode.
Electrostatic force microscopy.
Magnetic force microscopy.
Sample characterization in liquid.
X-Y scan range: 35 µm x 35 µm.
Z range: 6 µm.
User customizable software and hardware inputs.
Viscoelastic mapping of mechanical properties.
Nanoscale mechanical properties for diverse materials.
Force spectroscopy.
Surface roughness measurements.
Electrical measurements.
Piezoresponse force mapping.

·     X-Ray Diffraction
X
射线衍射
9 kW rotating anode x-ray generator.
X-ray generator ranges: 20 kV to 45 kV; 10 mA to 200 mA.
Scintillation point detector and a high-speed position sensitive detector system.
Five axis high resolution goniometer with an Eulerian cradle, X-Y-Z sample stage.
Parallel beam optics with a multi-layer X-ray mirror.
Bragg Brentano focusing optics.
Computer controlled variable divergence slit, variable anti-scatter slit, and receiving slit.
Germanium (220) 2-bounce and 4-bounce channel cut monochromators, and a germanium (220) 2-bounce analyzer.
Anton Paar domed hot stage for high temperature measurements of up to 1100 oC in air, vacuum, or inert gas.

·     FE-SEM and FIB
场发射扫描电子显微镜与聚焦离子束

FE-SEM

o    Resolution: sub-nanometer from 1 kV to 30 kV.

o    High resolution triple in-lens electron detectors with Through Lens (TLD, secondary and backscatter mode), In Column (ICD, low-loss backscatter), and Mirror (MD, no-loss backscatter) detectors.

o    Scanning transmission electron microscopy (STEM) detector with bright-field (BF), dark-field (DF), and high-angle annular dark-field (HAADF) segments.

o    Electron beam deceleration for 50 V effective landing voltage.

o    5-axis stage with 150 mm X-Y range and full rotation.

o    Integrated plasma cleaner to minimize contamination.

FIB (Gallium ion source)

o    Resolution: 2.5 nm at 30 kV.

o    High current for fast milling of large areas.

o    High efficiency secondary ion detector.

o    Electron flood gun for ion charge compensation.

o    Integrated beam current measurement to allow faster ion beam calibrations while samples are already in the chamber.

o    Real time monitoring of milling and deposition processes.

o    End point monitoring for cross sectioning and circuit editing applications.

o    Oxford/Omniprobe 300 manipulator for removing transmission electron microscopy (TEM) samples.

·         Enhanced capabilities for simultaneous chemical characterization using energy dispersive x-ray spectroscopy on an Oxford Instruments X-Max 80 mm2 SDD-EDS detector and material crystallographic characterization using electron backscatter diffraction on an Oxford Instruments NordlysMax2 EBSD detector.

·         Gas injection system chemistries

o    Platinum deposition.

o    Carbon deposition.

o    Insulator deposition using tetraethyl orthosilicate (TEOS).

o    Selective carbon etch.

o    Insulator enhanced etching using xenon difluoride (XeF2).