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Metrology 测量


·         Stress Measurement Tool

·         Ecopia Hall Effect Measurement System

·         Contact Profilometers for thickness measurement

·         Stereo Microscopes

·         Compound Optical Microscopes

·         Four Point Probe for the measurements of sheep resistance of substrates and films

·         Ion milling

·         Annealing

·         Wafer dicing

·         CMP and Wafer Cleaner (available mid of 2018)

o    Capable of handling wafers from 75 mm to 200 mm in diameter.

o    A primary platen to remove the material.

o    A secondary platen to do the final polish and minimize the surface roughness.

o    Within-wafer non-uniformity < 3 %.

o    Wafer-to-wafer non-uniformity < 5 %.